E04C 2002/3422
With polygonal dimples
Official title: {with polygonal dimples}
E04C2002/3422 (With polygonal dimples) appears on 23 US grants and 20 published applications in this corpus.
Search patents in E04C- Granted patents
- 23
- Published applications
- 20
- Assignees
- 14
- Inventors
- 47
- Latest grant
- 3 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 2 |
| 2003 | 1 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 2 |
| 2006 | 1 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 1 |
| 2013 | 1 | 2 |
| 2014 | 0 | 1 |
| 2015 | 0 | 3 |
| 2016 | 2 | 0 |
| 2017 | 2 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Resistant modular hollowed-out plate for manufacturing slabs3 Sep 2024US 12,077,962 B2
- Plastic core structure manufactured through twin sheet technology21 Jun 2022US 11,365,542 B2Shuert Technology, LLC
- Honeycomb structure element26 Sep 2017US 9,770,882 B2Rep IP AG
- Honeycomb structure element28 Feb 2017US 9,579,866 B2Rep IP AG
- Panel structure and method for producing the same23 Aug 2016US 9,421,731 B2Mitsubishi Heavy Industries, Ltd.
- Panel structure and method for manufacturing the same7 Jan 2021US 2021/0002895 A1Mitsubishi Heavy Industries, Ltd.
- Resistant modular hollowed-out plate for manufacturing slabs22 Oct 2020US 2020/0332528 A1
- Plastic core structure manufactured through twin sheet technology11 Jul 2019US 2019/0211556 A1Shuert Technology, LLC
- Honeycomb Structure Element4 May 2017US 2017/0120553 A1Rep IP AG
- Pyramid waffle core structure and method of fabrication8 Oct 2015US 2015/0284945 A1The Boeing Company
Most cited
By later US patents