D21J 1/02
Cutting
Official title: Cutting, e.g. using wet saws
D21J1/02 (Cutting) appears on 4 US grants and 10 published applications in this corpus.
Search patents in D21J- Granted patents
- 4
- Published applications
- 10
- Assignees
- 7
- Inventors
- 22
- Latest grant
- 27 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 2 | 4 |
By publication year.
Recent patents
- Pulp molded product line with roll forming function27 May 2025US 12,312,748 B2Shurcon Manufacturing (Zhejiang) Co., Ltd.
- Method for edge-forming cellulose products in a forming mould system, and a forming mould system for forming edges of cellulose products28 Jan 2025US 12,208,591 B2PulPac AB
- Dosing device29 Oct 2024US 12,130,164 B2Societe des Produits Nestle S. A.
- Consistently-automated production machines and method for preparing dried paper article28 Nov 2023US 11,825,879 B2Golden Arrow Printing Technology (Kunshan) Co., Ltd.
- Method and tool for producing a breakable weak point in molded bodies made of fiber-containing material and molded bodies made of fiber-containing material having a breakable weak point20 Nov 2025US 2025/0354337 A1KIEFEL GmbH
- In-line paperboard moisturizing5 Jun 2025US 2025/0179738 A1Brown LLC
- Preparation of a foam comprising discrete units of foam embedded in a foam matrix27 Feb 2025US 2025/0067002 A1Stora Enso OYJ
- Dosing device9 Jan 2025US 2025/0012612 A1Societe des Produits Nestle S. A.
- A method for edge-forming cellulose products in a forming mould system, and a forming mould system for forming edges of cellulose products11 Jan 2024US 2024/0009950 A1PulPac AB
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.