C09J 185/04
Containing boron
Official title: containing boron
C09J185/04 (Containing boron) appears on 4 US grants and 4 published applications in this corpus.
Search patents in C09J- Granted patents
- 4
- Published applications
- 4
- Assignees
- 3
- Inventors
- 20
- Latest grant
- 25 Apr 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Methods of assembling apparel products having boronate adhesives25 Apr 2023US 11,634,616 B1
- Boroxine based dynamic thermosetting polymers28 Jun 2022US 11,370,889 B2The Regents of the University of California
- Polymeric composition comprising metal alkoxide condensation product, organic silane compound and boron compound12 May 2015US 9,029,449 B2Nitto Boseki Co., Ltd.
- Recording medium for heat sensitive transfer printing20 Aug 1996US 5,547,739 ASony Corporation
- Adhesive composition and preparation method thereof, and optical adhesive film and application thereof27 Feb 2025US 2025/0066652 A1
- Hyper-crosslinked polymer compound, platinum group metal adsorbent, method for synthesizing hyper-crosslinked polymer compound, and method of using hyper-crosslinked polymer compound as adsorbent23 Jan 2025US 2025/0026891 A1
- Boroxine based dynamic thermosetting polymers21 Nov 2019US 2019/0352469 A1The Regents of the University of California
- Polymeric composition comprising metal alkoxide condensation product, organic silane compound and boron compound8 Oct 2009US 2009/0252970 A1Nitto Boseki Co., Ltd.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.