C09J 183/16
In which all the silicon atoms are connected by linkages other than
Official title: in which all the silicon atoms are connected by linkages other than oxygen atoms
C09J183/16 (In which all the silicon atoms are connected by linkages other than) appears on 14 US grants and 20 published applications in this corpus.
Search patents in C09J- Granted patents
- 14
- Published applications
- 20
- Assignees
- 15
- Inventors
- 39
- Latest grant
- 30 Jan 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 3 |
| 2014 | 3 | 2 |
| 2015 | 0 | 3 |
| 2016 | 0 | 3 |
| 2017 | 1 | 1 |
| 2018 | 5 | 1 |
| 2019 | 0 | 1 |
| 2020 | 0 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 1 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Glassy adhesive30 Jan 2024US 11,884,848 B2Shin-Etsu Chemical Co., Ltd.
- Adhesive composition, covering substrate, and cured product19 Sep 2023US 11,760,903 B2Shin-Etsu Chemical Co., Ltd.
- Methods and systems using molecular glue for covalent bonding of solid substrates28 Jun 2022US 11,370,941 B2Hi LLC
- Silane modified formamides13 Nov 2018US 10,125,155 B2Covestro Deutschland AG
- Two-component hot-melt adhesive16 Oct 2018US 10,099,464 B2Henkel AG & Co. KGaA
- Multi-functional silizane-based coatings and materials12 Oct 2023US 2023/0323155 A1Powdermet, Inc.
- Glassy adhesive3 Nov 2022US 2022/0348805 A1Shin-Etsu Chemical Co., Ltd.
- Adhesive composition, covering substrate, and cured product28 Oct 2021US 2021/0332265 A1Shin-Etsu Chemical Co., Ltd.
- Methods and systems using molecular glue for covalent bonding of solid substrates23 Apr 2020US 2020/0123416 A1Hi LLC
- Wet friction material with chemically-attached friction modifier16 May 2019US 2019/0145478 A1Schaeffler Technologies AG & Co. KG
Most cited
By later US patents
- Method for surface priming in adhesive bonding11US 4,617,078 AShin-Etsu Chemical Co., Ltd. · 1986
- Adhesive composition comprising organometallic polymer9US 4,808,659 AUbe Industries, Ltd. · 1989
- Adhesive composition and adhesive dry film7US 8,889,810 B2Shin-Etsu Chemical Co., Ltd. · 2014
- Silane-modified formamides2US 10,040,808 B2Covestro Deutschland AG · 2018
- Curable composition2US 8,907,024 B2Kaneka Corporation · 2014