C08J 9/101
Agents modifying the decomposition temperature
Official title: {Agents modifying the decomposition temperature}
C08J9/101 (Agents modifying the decomposition temperature) appears on 29 US grants and 13 published applications in this corpus.
Search patents in C08J- Granted patents
- 29
- Published applications
- 13
- Assignees
- 23
- Inventors
- 68
- Latest grant
- 4 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 0 | 2 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 1 | 0 |
| 2022 | 2 | 2 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 2 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Mold device for resin molded article, molding apparatus, molding system, and method for manufacturing molded article4 Nov 2025US 12,459,173 B2
- System and method for flexible sealant with density modifier9 Sep 2025US 12,410,295 B2Polymer Adhesives, LLC
- System and method for flexible sealant with density modifier22 Nov 2022US 11,505,672 B2Polymer Adhesive Sealant Systems, Inc.
- System and method for flexible sealant with density modifier22 Nov 2022US 11,505,673 B2Polymer Adhesive Sealant Systems, Inc.
- System and method for flexible sealant with density modifier24 Aug 2021US 11,098,174 B2Polymer Adhesives Sealant Systems, Inc.
- System and method for flexible sealant with density modifier1 Jan 2026US 2026/0002008 A1Polymer Adhesives, LLC
- System and method for flexible sealant with density modifier16 Mar 2023US 2023/0082565 A1Polymer Adhesive Sealant Systems, Inc.
- Mold device for resin molded article, molding apparatus, molding system, and method for manufacturing molded article14 Jul 2022US 2022/0219358 A1
- Gas generating agent, foamable composition, foam, and method of producing foam2 Jun 2022US 2022/0169815 A1Eiwa Chemical Ind. Co., Ltd.
- System and method for flexible sealant with density modifier13 Aug 2020US 2020/0255616 A1Polymer Adhesives Sealant Systems, Inc.
Most cited
By later US patents
- Process for preparing a foamed body having an annular ring pattern in cross-section52US 4,048,101 ADaicel Corporation · 1977
- Randomly embossed surface covering46US 4,277,427 ACongoleum Corporation · 1981
- Production of foamed low-density polypropylene by rotational molding42US 6,103,153 A2000
- Expanding thermoplastic resin beads with very high frequency energy23US 5,128,073 AGeneral Electric Company · 1992
- Expandable resin composition14US 4,021,380 AMattel, Inc. · 1977