C08J 2459/02
Copolyoxymethylenes
C08J2459/02 (Copolyoxymethylenes) appears on 3 US grants and 4 published applications in this corpus.
Search patents in C08J- Granted patents
- 3
- Published applications
- 4
- Assignees
- 4
- Inventors
- 13
- Latest grant
- 12 Jul 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year.
Recent patents
- Polyacetal resin composition, molded article and method for manufacturing polyacetal resin composition12 Jul 2022US 11,384,237 B2Mitsubishi Engineering-Plastics Corporation
- Water soluble polymer powders with improved dispersibility13 Sep 2016US 9,441,118 B2Hercules Incorporated
- Thermoformed articles and compositions of poly(hydroxyalkanoic acid) and polyoxymethylene22 May 2012US 8,182,734 B1E. I. Du Pont de Nemours and Company
- Semiconductive polypropylene composition4 Jan 2024US 2024/0002647 A1Borealis AG
- Polyacetal resin composition, molded article and method for manufacturing polyacetal resin composition16 Apr 2020US 2020/0115542 A1Mitsubishi Engineering-Plastics Corporation
- Water Soluble Polymer Powders with Improved Dispersibility9 Jan 2014US 2014/0007791 A1Hercules Incorporated
- Polyoxymethylene Polymer Compositions Having Improved Creep24 May 2012US 2012/0129976 A1E. I. Du Pont de Nemours and Company
Most cited
By later US patents