B65H 2701/1828

Parts concerned of piled package

B65H2701/1828 (Parts concerned of piled package) appears on 16 US grants and 16 published applications in this corpus.

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Granted patents
16
Published applications
16
Assignees
12
Inventors
34
Latest grant
9 Feb 2016

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B65H 2701/1828: granted patents and published applications per publication year
YearGranted patentsPublished applications
200111
200210
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200600
200701
200810
200902
201014
201111
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201401
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