B29L 2031/3487
Resistors
Official title: {Resistors}
B29L2031/3487 (Resistors) appears on 5 US grants and 9 published applications in this corpus.
Search patents in B29L- Granted patents
- 5
- Published applications
- 9
- Assignees
- 6
- Inventors
- 35
- Latest grant
- 20 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 2 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 2 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Heatable plastics component and method for producing20 Jan 2026US 12,531,322 B2Hella GmbH & Co. KGaA
- Three-dimensional printing25 Jun 2024US 12,017,406 B2Hewlett-Packard Development Company, L. P.
- Method for manufacturing a 3D item having an electrically conductive coil5 Jul 2022US 11,376,785 B2Signify Holding B. V.
- Temperature sensors14 Dec 2021US 11,199,456 B2Hewlett-Packard Development Company, L. P.
- Packaging device of electronic components and an encapsulation method thereof15 Dec 2020US 10,864,666 B2Walsin Technology Corporation
- Three-dimensional printing24 Oct 2024US 2024/0351274 A1Hewlett-Packard Development Company, L. P.
- Heatable plastics component and method for producing22 Dec 2022US 2022/0407214 A1Hella GmbH & Co. KGaA
- Three-dimensional printing10 Feb 2022US 2022/0040918 A1Hewlett-Packard Development Company, L. P.
- Method for manufacturing a 3d item having an electrically conductive coil19 Nov 2020US 2020/0361138 A1Signify Holding B. V.
- Temperature sensors8 Aug 2019US 2019/0242758 A1Hewlett-Packard Development Company, L. P.
Most cited
By later US patents