B29K 2103/00
Use of resin-bonded materials as moulding material
B29K2103/00 (Use of resin-bonded materials as moulding material) appears on 119 US grants and 187 published applications in this corpus.
Search patents in B29K- Granted patents
- 119
- Published applications
- 187
- Assignees
- 124
- Inventors
- 372
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 2 |
| 2003 | 2 | 0 |
| 2004 | 0 | 2 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 1 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 5 |
| 2013 | 2 | 5 |
| 2014 | 3 | 4 |
| 2015 | 5 | 29 |
| 2016 | 5 | 24 |
| 2017 | 8 | 21 |
| 2018 | 13 | 19 |
| 2019 | 10 | 13 |
| 2020 | 17 | 11 |
| 2021 | 10 | 18 |
| 2022 | 11 | 11 |
| 2023 | 7 | 8 |
| 2024 | 7 | 3 |
| 2025 | 8 | 4 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Ultra-high molecular weight polyethylene anti-wear composite material modified by manganese phosphate nanosheet and preparation method thereof8 Sep 2026US 12,728,571 B2China Academy of Machinery Wuhan Research Institute of Materials Protection Co. Ltd.
- Molded article with metallic appearance11 Aug 2026US 12,703,789 B2The Procter & Gamble Company
- Metal plated additively manufactured plastic ACM rotors with internal thermally adaptive structure4 Aug 2026US 12,697,768 B2Hamilton Sundstrand Corporation
- Device and method for producing spacers2 Jun 2026US 12,642,660 B2Heraeus Medical GmbH
- Methods for dispensing and forming 3A molecular sieve hot melt entrained polymers onto substrates28 Apr 2026US 12,611,809 B2CSP Technologies, Inc.
- Mold14 May 2026US 2026/0131505 A1American Woodmark Management Company
- Container and method of manufacture23 Apr 2026US 2026/0109103 A1Ring Container Technologies, LLC
- Inorganic or ceramic particle filled polymer composites for high thermal conductivity applications2 Apr 2026US 2026/0091543 A1U.S. Government as represented by the Secretary of the Army
- Pellets, systems and methods of making pellets, and systems and methods of making insulated products using pellets5 Mar 2026US 2026/0061668 A1Temperpack Technologies, Inc.
- Improved adhesion of fdm printed layer to a metal part4 Dec 2025US 2025/0367870 A1Signify Holding B. V.
Most cited
By later US patents
- Carbon for high voltage EDLCs57US 9,136,064 B2Corning Incorporated · 2015
- Method of manufacturing a molded door skin from a flat wood composite, door skin produced therefrom, and door manufactured therewith52US 6,312,540 B1MDF, Inc. · 2001
- Method and material system for building models in layers46US 9,321,934 B2Voxeljet AG · 2016
- Molding process and device therefor25US 4,874,564 ASumitomo Metal Industries, Ltd. · 1989
- Method of manufacturing a molded door skin from a flat wood composite, door skin produced therefrom, and door manufactured therewith21US 7,856,779 B2Masonite Corporation · 2010