B29C 2945/76183
Hopper
Official title: hopper
B29C2945/76183 (Hopper) appears on 10 US grants and 19 published applications in this corpus.
Search patents in B29C- Granted patents
- 10
- Published applications
- 19
- Assignees
- 14
- Inventors
- 35
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 2 |
| 2003 | 0 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 0 |
| 2006 | 1 | 0 |
| 2007 | 1 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 2 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 0 | 1 |
| 2022 | 0 | 2 |
| 2023 | 0 | 2 |
| 2024 | 2 | 0 |
| 2025 | 1 | 2 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for supporting molding of pulverized material resin material16 Jun 2026US 12,654,377 B2Nissei Plastic Industrial Co., Ltd.
- Method for the quality control and/or tracking of an injection molded part produced in a production cycle, and plastic industrial facility for this purpose11 Feb 2025US 12,220,848 B2Wittmann Technology GmbH
- Plasticizing device, three-dimensional shaping apparatus, and injection molding apparatus5 Nov 2024US 12,134,231 B2Seiko Epson Corporation
- Plasticizing device, injection molding apparatus, and three-dimensional shaping apparatus9 Jan 2024US 11,865,752 B2Seiko Epson Corporation
- Feeding system25 Sep 2012US 8,272,535 B2Hon Hai Precision Industry Co., Ltd.
- Molding condition setting method3 Jul 2025US 2025/0214292 A1Seiko Epson Corporation
- Feeder and injection molding machine22 May 2025US 2025/0162219 A1The Japan Steel Works, Ltd.
- Method for supporting molding of pulverized material resin material28 Dec 2023US 2023/0415393 A1Nissei Plastic Industrial Co., Ltd.
- Method for molding resin material mixed with pulverized material30 Nov 2023US 2023/0382011 A1Nissei Plastic Industrial Co., Ltd.
- Plasticizing device, three-dimensional shaping apparatus, and injection molding apparatus22 Dec 2022US 2022/0402210 A1Seiko Epson Corporation
Most cited
By later US patents
- Injection molding machine10US 7,431,583 B2Fanuc Corporation · 2008
- System for feeding portions of material to an injection molding machine8US 6,688,493 B22004
- System for feeding portions of material to an injection molding machine7US 6,966,456 B22005
- Temperature regulator of temperature regulating part under hopper of injection molding machine5US 7,249,940 B2Fanuc Corporation · 2007
- Feeding system2US 8,272,535 B2Hon Hai Precision Industry Co., Ltd. · 2012