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  1. Technology classes
  2. /B · Performing operations
  3. /B29 · Working of plastics
  4. /B29C · Shaping or joining of plastics
  5. /B29C 2945/00 · Indexing scheme relating to injection moulding, i.e. forcing the required volume of
  6. /B29C 2945/76 · Measuring, controlling or regulating
  7. /B29C 2945/76003 · Measured parameter
  8. /B29C 2945/7614
B29C 2945/7614

Humidity, moisture

B29C2945/7614 (Humidity, moisture) appears on 4 US grants and 11 published applications in this corpus.

Search patents in B29C

Where it sits

  1. BPerforming operations
  2. B29Working of plastics
  3. B29CShaping or joining of plastics
  4. B29C 2945/00Indexing scheme relating to injection moulding, i.e. forcing the required volume of
  5. B29C 2945/76Measuring, controlling or regulating
  6. B29C 2945/76003Measured parameter
  7. B29C 2945/7614Humidity, moisture
Granted patents
4
Published applications
11
Assignees
7
Inventors
16
Latest grant
11 Nov 2025

Filings by year

Granted patentsPublished applications
B29C 2945/7614: granted patents and published applications per publication year
YearGranted patentsPublished applications
200704
200800
200900
201000
201100
201200
201300
201400
201501
201600
201710
201800
201900
202001
202100
202201
202312
202400
202522

200720172025

By publication year.

Recent patents

  • Hot runner process controller11 Nov 2025US 12,466,117 B2Incoe Corporation
  • Injection molding machine management system25 Feb 2025US 12,233,584 B2Seiko Epson Corporation
  • Hot runner process controller11 Jul 2023US 11,697,236 B2Incoe Corporation
  • Device and method for measuring the moisture in die casting molds31 Oct 2017US 9,804,085 B2Fondarex SA
  • Molding condition setting method3 Jul 2025US 2025/0214292 A1Seiko Epson Corporation
  • Control device for injection molding machine, injection molding machine, and control method for injection molding machine26 Jun 2025US 2025/0205951 A1Sumitomo Heavy Industries, Ltd.
  • Hot runner process controller21 Sep 2023US 2023/0294345 A1Incoe Corporation
  • Injection Molding Machine Management System29 Jun 2023US 2023/0202087 A1Seiko Epson Corporation
  • Hot runner process controller23 Jun 2022US 2022/0193970 A1Incoe Corporation

Most cited

By later US patents

No patent in this class has been cited by a later US patent yet.

Top assignees

Documents
  • IIncoe Corporation4
  • Seiko Epson Corporation3
  • FFondarex SA2
  • HIHusky Injection Molding Systems Ltd.2
  • HIHusky Injection Molding Systems Ltd.1
  • Sumitomo Heavy Industries, Ltd.1
  • TTechnicolor, Inc.1

Often classified with

  • B22DCasting of metals5
  • B22CFoundry moulding2
  • G01NInvestigating or analysing materials by determining their chemical or physical properties2
  • B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding1
  • G05BControl or regulating systems in general1
  • G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial1
  • G07CTime or attendance registers1
  • Y02WClimate change mitigation technologies related to wastewater treatment or waste management1

Documents that also carry the other class.

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