B29C 2045/848
Detecting or preventing overload of an injection plunger
Official title: {detecting or preventing overload of an injection plunger}
B29C2045/848 (Detecting or preventing overload of an injection plunger) appears on 5 US grants and 1 published applications in this corpus.
Search patents in B29C- Granted patents
- 5
- Published applications
- 1
- Assignees
- 3
- Inventors
- 9
- Latest grant
- 30 Jun 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Moulding assembly30 Jun 2020US 10,695,967 B2Tetra Laval Holdings & Finance S. A.
- Failsafe shooting pot actuator for an injection molding machine21 Aug 2001US 6,276,916 B1Husky Injection Molding Systems Ltd.
- Method for forming encapsulated semicondcutor chips25 Nov 1997US 5,690,885 A
- Automatic plunger apparatus for use in forming encapsulated semiconductor chips26 Dec 1995US 5,478,226 A
- Device for introducing a plastic material into a mould cavity12 Jul 1994US 5,328,347 AAMCO Hi-Tech B.V.
Most cited
By later US patents
- Failsafe shooting pot actuator for an injection molding machine16US 6,276,916 B1Husky Injection Molding Systems Ltd. · 2001
- Device for introducing a plastic material into a mould cavity4US 5,328,347 AAMCO Hi-Tech B.V. · 1994
- Method for forming encapsulated semicondcutor chips4US 5,690,885 A1997
- Automatic plunger apparatus for use in forming encapsulated semiconductor chips1US 5,478,226 A1995