B29C 2045/2691
Sequentially filled
Official title: {sequentially filled}
B29C2045/2691 (Sequentially filled) appears on 12 US grants and 20 published applications in this corpus.
Search patents in B29C- Granted patents
- 12
- Published applications
- 20
- Assignees
- 17
- Inventors
- 49
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 2 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 3 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 2 | 1 |
| 2019 | 2 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 2 |
| 2022 | 0 | 2 |
| 2023 | 2 | 1 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Rotor core molding method and system for molding a rotor core of an electric motor31 Mar 2026US 12,592,620 B2Boschman Technologies B.V.
- Sequential injection to multiple mold cavities4 Apr 2023US 11,618,196 B2Synventive Molding Solutions, Inc.
- Mold, method of manufacturing article, and valve28 Mar 2023US 11,613,056 B2Canon Kabushiki Kaisha
- Filling method of conductive paste and manufacturing method of multi-layer printed circuit board11 Jun 2019US 10,321,578 B2Nippon Mektron, Ltd.
- Method of manufacturing housing structure and housing structure1 Jan 2019US 10,166,705 B2Jtekt Corporation
- Rotor core molding method and system for molding a rotor core of an electric motor2 May 2024US 2024/0146160 A1Boschman Technologies B.V.
- Sequential Injection to Multiple Mold Cavities29 Jun 2023US 2023/0202086 A1Synventive Molding Solutions, Inc.
- Injection molding apparatus and injection molding method14 Apr 2022US 2022/0111572 A1Chung Yuan Christian University
- Injection molding system27 Jan 2022US 2022/0024093 A1Canon Virginia, Inc.
- Sequential injection to multiple mold cavities2 Sep 2021US 2021/0268707 A1Synventive Molding Solutions, Inc.
Most cited
By later US patents
- Apparatus for family mold sequential molding24US 5,773,038 A1998
- Method and apparatus for injection molding4US 6,875,383 B2MHI Injection Moulding Machinery, Inc. · 2005
- Method and device for injection molding4US 7,749,419 B2Honda Motor Co., Ltd. · 2010
- Filling method of conductive paste and manufacturing method of multi-layer printed circuit board2US 10,321,578 B2Nippon Mektron, Ltd. · 2019
- Injection-molding method and apparatus2US 7,947,208 B2Honda Motor Co., Ltd. · 2011