B29C 2045/1739
Controlling the temperature or heat-transfer in fluid injection nozzles
Official title: {controlling the temperature or heat-transfer in fluid injection nozzles}
B29C2045/1739 (Controlling the temperature or heat-transfer in fluid injection nozzles) appears on 6 US grants and 5 published applications in this corpus.
Search patents in B29C- Granted patents
- 6
- Published applications
- 5
- Assignees
- 7
- Inventors
- 22
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 2 | 1 |
| 2024 | 1 | 2 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Control device for injection molding machine and control method for injection molding machine24 Mar 2026US 12,583,155 B2Sumitomo Heavy Industries, Ltd.
- Side gate nozzle and injection mold17 Jun 2025US 12,330,358 B2Thermoplay S.p,A.
- Filter device28 May 2024US 11,992,985 B2Engel Austria GmbH
- Material delivery device, three-dimensional shaping device, and injection molding device8 Aug 2023US 11,718,006 B2Seiko Epson Corporation
- Temperature control unit, system, and method for molding equipment31 Jan 2023US 11,565,453 B2Sterling Products, Inc.
- Side gate nozzle and injection mold11 Apr 2024US 2024/0116226 A1Thermoplay S.p,A.
- Filter device11 Jan 2024US 2024/0009901 A1Engel Austria GmbH
- Control device for injection molding machine and control method for injection molding machine8 Jun 2023US 2023/0173722 A1Sumitomo Heavy Industries, Ltd.
- Material Delivery Device, Three-Dimensional Shaping Device, And Injection Molding Device27 Jan 2022US 2022/0024097 A1Seiko Epson Corporation
- Temperature Control Unit, System, and Method for Molding Equipment7 Nov 2019US 2019/0337210 A1Sterling Products, Inc.
Most cited
By later US patents