B28D 1/327
For cutting or shearing easily splittable working materials
Official title: {for cutting or shearing easily splittable working materials}
B28D1/327 (For cutting or shearing easily splittable working materials) appears on 5 US grants and 5 published applications in this corpus.
Search patents in B28D- Granted patents
- 5
- Published applications
- 5
- Assignees
- 3
- Inventors
- 8
- Latest grant
- 27 Jul 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
By publication year.
Recent patents
- Wafer and wafer producing method27 Jul 2021US 11,072,042 B2Disco Corporation
- Shape memory alloy rock splitters (SMARS)9 Jun 2020US 10,675,781 B1The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- Shape memory alloy rock splitters (SMARS)16 May 2017US 9,649,780 B1The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- Brick cutting apparatuses and methods28 Aug 2012US 8,251,052 B2VAST Enterprises, LLC
- Shingle cutter2 Jul 2002US 6,412,382 B1
- Wafer and wafer producing method16 Jul 2020US 2020/0223015 A1Disco Corporation
- Cutting method for crackly plate-shaped work piece and cutting device thereof7 Nov 2013US 2013/0291851 A1
- Brick cutting apparatuses and methods2 Sep 2010US 2010/0218752 A1VAST Enterprises, LLC
- Cutting means for a slate cutter21 Aug 2008US 2008/0196705 A1
- Apparatus for cutting stone21 Aug 2008US 2008/0196706 A1
Most cited
By later US patents