B23B 2228/41
Highly conductive
B23B2228/41 (Highly conductive) appears on 7 US grants and 10 published applications in this corpus.
Search patents in B23B- Granted patents
- 7
- Published applications
- 10
- Assignees
- 9
- Inventors
- 21
- Latest grant
- 2 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 2 |
| 2021 | 0 | 1 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 2 | 1 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Tool with wear detection2 Dec 2025US 12,485,491 B2Guehring KG
- Snap adapter for tool component2 Jul 2024US 12,027,833 B2Hubbell Power Systems, Inc.
- Systems and methods for removing undesired metal within vias from printed circuit boards28 May 2024US 11,997,800 B2TTM Technologies, Inc.
- Tool cutting element9 Aug 2022US 11,407,038 B2Element Six (UK) Limited
- Snap adapter for tool component27 Oct 2020US 10,819,091 B2Ripley Tools, LLC
- Systems and methods for removing undesired metal within vias from printed circuit boards6 Nov 2025US 2025/0344323 A1TTM Technologies, Inc.
- Cutting insert with sensor arrangement and method for manufacturing a cutting insert1 Feb 2024US 2024/0033830 A1Sandvik Intellectual Property AB
- Tool With Wear Detection15 Jun 2023US 2023/0182211 A1Guehring KG
- Board Drilling Apparatus, Drill Bit, and Method for Board Drilling Apparatus to Drill a Board24 Nov 2022US 2022/0371103 A1
- Systems and methods for removing undesired metal within vias from printed circuit boards6 May 2021US 2021/0136928 A1TTM Technologies, Inc.
Most cited
By later US patents