B22F 3/168
Local deformation
Official title: {Local deformation}
B22F3/168 (Local deformation) appears on 14 US grants and 26 published applications in this corpus.
Search patents in B22F- Granted patents
- 14
- Published applications
- 26
- Assignees
- 24
- Inventors
- 69
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 2 | 3 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 2 |
| 2019 | 0 | 4 |
| 2020 | 1 | 4 |
| 2021 | 3 | 1 |
| 2022 | 1 | 2 |
| 2023 | 2 | 2 |
| 2024 | 2 | 1 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Pressure-sintering method employing deformation uptake means16 Jun 2026US 12,654,223 B2Danfoss Silicon Power GmbH
- Method for producing a sintered part8 Jul 2025US 12,350,732 B2GKN Sinter Metals Engineering GmbH
- Method and system for improving the surface fracture toughness of brittle materials, and a cutting tool produced by such method8 Oct 2024US 12,109,616 B2Csir
- Additive manufacturing method and device for ceramic and composite thereof6 Feb 2024US 11,890,780 B2Huazhong University of Science and Technology
- Metal object and manufacturing method thereof having solid lubricating surface layer19 Sep 2023US 11,759,858 B2Metal Industries Research & Development Centre
- Wrought metallic article and method for manufacturing the same from a metallic-powder composition13 Feb 2025US 2025/0050414 A1The Boeing Company
- Pressure-sintering method employing deformation uptake means26 Sep 2024US 2024/0316638 A1Danfoss Silicon Power GmbH
- Cutting tool13 Apr 2023US 2023/0114244 A1Sumitomo Electric Industries, Ltd.
- Method for Producing a Sintered Part12 Jan 2023US 2023/0009436 A1GKN Sinter Metals Engineering GmbH
- Additive manufacturing method and device for ceramic and composite thereof12 May 2022US 2022/0143868 A1Huazhong University of Science and Technology
Most cited
By later US patents