B22F 2003/1052
Assisted by energy absorption enhanced by the coating or powder
Official title: {assisted by energy absorption enhanced by the coating or powder}
B22F2003/1052 (Assisted by energy absorption enhanced by the coating or powder) appears on 30 US grants and 18 published applications in this corpus.
Search patents in B22F- Granted patents
- 30
- Published applications
- 18
- Assignees
- 19
- Inventors
- 74
- Latest grant
- 15 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 2 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 0 | 4 |
| 2019 | 0 | 2 |
| 2020 | 2 | 3 |
| 2021 | 1 | 2 |
| 2022 | 1 | 0 |
| 2023 | 0 | 1 |
| 2024 | 1 | 2 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Printing conductive elements15 Jul 2025US 12,358,243 B2Hewlett-Packard Development Company, L. P.
- Hardmetals and method for producing the same11 Jun 2024US 12,006,559 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Metal powder for metal additive manufacturing and molded object produced using said metal powder1 Mar 2022US 11,260,451 B2JX Nippon Mining & Metals Corporation
- Scanning strategy for perimeter and region isolation30 Mar 2021US 10,960,603 B2General Electric Company
- Laser shock peening within an additive manufacturing process3 Nov 2020US 10,821,519 B2General Electric Company
- Copper, gold, or silver powder for powder bed additive manufacturing and method of manufacturing such powder12 Sep 2024US 2024/0300014 A1Katholieke Universiteit Leuven
- Printing conductive elements9 May 2024US 2024/0149542 A1Hewlett-Packard Development Company, L. P.
- Hard metals and method for producing the same16 Feb 2023US 2023/0052721 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Additively manufacturing a 3d object including a second material7 Oct 2021US 2021/0308941 A1Hewlett-Packard Development Company, L. P.
- Printing conductive elements10 Jun 2021US 2021/0170678 A1Hewlett-Packard Development Company, L. P.
Most cited
By later US patents
- Method and apparatus for producing parts by selective sintering887US 4,863,538 ABoard of Regents, The University of Texas System · 1989
- Multiple material systems for selective beam sintering380US 4,944,817 ABoard of Regents, The University of Texas System · 1990
- Method for selective laser sintering with layerwise cross-scanning368US 5,155,324 A1992
- Selective laser sintering with assisted powder handling352US 4,938,816 ABoard of Regents, The University of Texas System · 1990
- Multiple material systems for selective beam sintering335US 5,076,869 ABoard of Regents, The University of Texas System · 1991