Technoplas, Inc.
Tokyo, JP· latest recorded location
Technoplas, Inc. is named on 3 US grants and 0 published applications in this corpus. Its most frequent classification is B29C (Shaping or joining of plastics).
- Granted patents
- 3
- Published applications
- 0
- Inventors
- 2
- Granted in 2026 so far
- 0
- Most recent grant
- 26 Dec 1989
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
By publication year.
Technology areas
Share of 3 documents
Recent patents
- Method for supervision of injection molding by use of waveform of internal die pressure26 Dec 1989US 4,889,667 A
- Ultrahigh speed injection molding method10 Jan 1989US 4,797,236 A
- Straight-hydraulic mold clamping system in molding machine17 May 1988US 4,744,740 A
No published applications.
Most cited
By later US patents