Sysko Corporation
Saitama-Ken, JP· latest recorded location
Sysko Corporation is named on 3 US grants and 2 published applications in this corpus. Its most frequent classification is B29C (Shaping or joining of plastics).
- Granted patents
- 3
- Published applications
- 2
- Inventors
- 2
- Granted in 2026 so far
- 0
- Most recent grant
- 25 Jul 2006
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
By publication year.
Technology areas
Share of 5 documents