Stackpole Limited
Oakville· latest recorded location
Stackpole Limited is named on 4 US grants and 0 published applications in this corpus. Its most frequent classification is B22F (Working metallic powder).
- Granted patents
- 4
- Published applications
- 0
- Inventors
- 11
- Granted in 2026 so far
- 0
- Most recent grant
- 19 Sep 2000
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
By publication year.
Technology areas
Share of 4 documents
- B22FWorking metallic powder3
- B30BPresses in general2
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2
- B21HMaking particular metal objects by rolling1
- B29CShaping or joining of plastics1
- C21DModifying the physical structure of ferrous metals1
- C22CAlloys1
- C23CCoating metallic material1
Recent patents
- Method of making a component using a phased split die19 Sep 2000US 6,120,728 A
- Point contact densification29 Aug 2000US 6,110,419 A
- Undercut split die8 Aug 2000US 6,099,772 A
- Plasma enhanced chemical vapor deposition wafer holding fixture17 Oct 1989US 4,873,942 A
No published applications.
Most cited
By later US patents