SMART Embedded Computing, Inc.
Tempe, AZ, US· latest recorded location
SMART Embedded Computing, Inc. is named on 7 US grants and 2 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 7
- Published applications
- 2
- Inventors
- 8
- Granted in 2026 so far
- 0
- Most recent grant
- 13 Sep 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2020 | 2 | 0 |
| 2021 | 4 | 2 |
| 2022 | 1 | 0 |
By publication year.
Technology areas
Share of 9 documents
- H05KPrinted circuits6
- G06FComputing and data processing5
- H01RElectrically-conductive connections3
- B23PMetal-working not otherwise provided for1
- F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange1
- F28FDetails of heat-exchange and heat-transfer apparatus, of general application1
- Y10TTechnical subjects covered by former us classification1
Recent patents
- Universal bracket for multiple form factors of PCIe cards in OCP sled environments13 Sep 2022US 11,442,498 B2
- Printed circuit board electrical connector locking via threaded fasteners3 Aug 2021US 11,083,099 B2
- Carrier for one or more solid state drives (SSDs)1 Jun 2021US 11,023,020 B2
- Configurable cooling for rugged environments1 Jun 2021US 11,026,347 B2
- Method and device to provide uniform cooling in rugged environments11 May 2021US 11,006,548 B2
Most cited
By later US patents
- Carrier for one or more solid state drives (SSDs)5US 11,023,020 B22021
- Method and device to provide uniform cooling in rugged environments1US 11,006,548 B22021
- Configurable cooling for rugged environments1US 11,026,347 B22021
- Printed circuit board electrical connector locking via threaded fasteners1US 11,083,099 B22021
- Universal bracket for multiple form factors of PCIe cards in OCP sled environments1US 11,442,498 B22022