Skytech
LE VAL D'HAZEY, FR· latest recorded location
SKYTECH is named on 3 US grants and 4 published applications in this corpus. Its most frequent classification is B03C (Magnetic or electrostatic separation of solid materials from solid materials or fluids).
- Granted patents
- 3
- Published applications
- 4
- Inventors
- 1
- Granted in 2026 so far
- 0
- Most recent grant
- 25 Jun 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2021 | 0 | 2 |
| 2022 | 2 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 7 documents
- B03CMagnetic or electrostatic separation of solid materials from solid materials or fluids7
- Y02WClimate change mitigation technologies related to wastewater treatment or waste management6
- B29BPreparation or pretreatment of the material to be shaped2
- B29LIndexing scheme associated with subclass b29c, relating to particular articles2
- G06FComputing and data processing2
- B01FMixing1
- B05CApparatus for applying fluent materials to surfaces, in general1
Recent patents
- Method for designing an electrostatic separating device of a mixture of different material granules and associated devices25 Jun 2024US 12,019,962 B2
- Device for electrostatic charging of a mixture of granules, associated method and use2 Aug 2022US 11,400,461 B2
- Electrostatic separation device, and associated separation method and use1 Mar 2022US 11,260,402 B2
- Method for separating a mixture of granules via the triboelectric effect5 Mar 2026US 2026/0061432 A1
- Method for designing an electrostatic separating device of a mixture of different material granules and associated devices3 Mar 2022US 2022/0067243 A1
- Device for electrostatic charging of a mixture of granules, associated method and use1 Apr 2021US 2021/0094047 A1
- Electrostatic separation device, and associated separation method and use25 Feb 2021US 2021/0053074 A1
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.