Sequa Corporation
Hackensack, NJ, US· latest recorded location
Sequa Corporation is named on 34 US grants and 4 published applications in this corpus. Its most frequent classification is B41F (Printing machines or presses).
- Granted patents
- 34
- Published applications
- 4
- Inventors
- 32
- Granted in 2026 so far
- 0
- Most recent grant
- 13 Apr 2010
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 2 |
| 2007 | 1 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
By publication year.
Technology areas
Share of 38 documents
- B41FPrinting machines or presses17
- Y10TTechnical subjects covered by former us classification10
- B22FWorking metallic powder8
- C22CAlloys8
- B21DWorking or processing of sheet metal or metal tubes, rods or profiles6
- B65HHandling thin or filamentary material5
- B26DCutting2
- B23KSoldering or unsoldering1
- B26FPerforating1
- B41PIndexing scheme relating to printing, lining machines, typewriters, and to stamps1
Recent patents
- Wire/fiber ring and method for manufacturing the same13 Apr 2010US 7,694,910 B2
- Wire/fiber ring and method for manufacturing the same27 May 2008US 7,377,465 B2
- Wire/fiber ring method for manufacturing the same30 Oct 2007US 7,287,719 B2
- Wire/fiber ring and method for manufacturing the same10 Oct 2006US 7,118,063 B2
- Replaceable inking arrangement in a can decorator30 Jan 2001US 6,178,886 B2
- Wire/fiber ring and method for manufacturing the same9 Aug 2007US 2007/0181733 A1
- Wire/fiber ring and method for manufacturing the same29 Mar 2007US 2007/0068619 A1
- Wire/fiber ring method for manufacturing the same21 Dec 2006US 2006/0286377 A1
- Wire/fiber ring and method for manufacturing the same2 Feb 2006US 2006/0024466 A1
Most cited
By later US patents
- Splicer tape system41US 5,323,981 A1994
- Apparatus and method for substantially reducing can spacing and speed to match chain pins38US 5,231,926 A1993
- Apparatus and method utilizing continuous motion offset and direct printing techniques for decorating cylindrical containers27US 5,337,659 A1994
- Rotary die cutter24US 5,001,950 A1991
- Off-line web finishing system with splice and missing mark stability23US 5,361,960 A1994