Robotron Corporation
Southfield, MI, US· latest recorded location
Robotron Corporation is named on 5 US grants and 0 published applications in this corpus. Its most frequent classification is H05B (Electric heating).
- Granted patents
- 5
- Published applications
- 0
- Inventors
- 5
- Granted in 2026 so far
- 0
- Most recent grant
- 2 Apr 2002
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
By publication year.
Technology areas
Share of 5 documents
Recent patents
- U-shaped adhesive bonding apparatus2 Apr 2002US 6,365,883 B1
- Multiple sequence welding controller16 Sep 1997US 5,667,704 A
- Method of induction bonding juxtaposed structural members15 Aug 1995US 5,442,159 A
- Induction heating coil for bonding metal sheets15 Nov 1994US 5,365,041 A
- Programmable weld and machine controller26 Jun 1990US 4,937,419 A
No published applications.
Most cited
By later US patents
- Programmable weld and machine controller24US 4,937,419 A1990
- Induction heating coil for bonding metal sheets8US 5,365,041 A1994
- Method of induction bonding juxtaposed structural members7US 5,442,159 A1995
- Multiple sequence welding controller6US 5,667,704 A1997
- U-shaped adhesive bonding apparatus6US 6,365,883 B12002