Plus Corporation

Osaka, JP· latest recorded location

Plus Corporation is named on 85 US grants and 31 published applications in this corpus. Its most frequent classification is B65H (Handling thin or filamentary material).

Searches 116 patents and applications
Granted patents
85
Published applications
31
Inventors
77
Granted in 2026 so far
3
Most recent grant
18 Aug 2026

Filings by year

Plus Corporation: granted patents and published applications per publication year
YearGranted patentsPublished applications
198620
198720
198860
198960
199070
199120
199210
199300
199400
199500
199610
199710
199810
199930
200070
200110
200210
200300
200400
200500
200600
200730
200800
200900
201020
201124
201293
201343
201443
201515
201623
201723
201820
201944
202030
202100
202211
202310
202412
202500
202630

By publication year. 2026 runs to 8 Oct.

Technology areas

Share of 116 documents