Moldtech Oy

Espoo, FI· latest recorded location

MOLDTECH OY is named on 2 US grants and 3 published applications in this corpus. Its most frequent classification is E01D (Construction of bridges, elevated roadways or viaducts).

Searches 5 patents and applications
Granted patents
2
Published applications
3
Inventors
3
Granted in 2026 so far
0
Most recent grant
8 Oct 2013