eSionic Corp.
Menlo Park, CA, US· latest recorded location
eSionic Corp. is named on 3 US grants and 2 published applications in this corpus. Its most frequent classification is Y10T (Technical subjects covered by former us classification).
- Granted patents
- 3
- Published applications
- 2
- Inventors
- 9
- Granted in 2026 so far
- 0
- Most recent grant
- 2 Aug 2016
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2015 | 1 | 1 |
| 2016 | 2 | 0 |
| 2017 | 0 | 1 |
By publication year.
Technology areas
Share of 5 documents
- Y10TTechnical subjects covered by former us classification4
- H01GCapacitors3
- Y02EClean energy generation and storage3
- B01DSeparation2
- B05DProcesses for applying fluent materials to surfaces, in general2
- C09KMaterials for miscellaneous applications, not provided for elsewhere2
- G11CStatic stores2
- H01BCables2
- H01MBatteries and fuel cells2
- H05KPrinted circuits2
Recent patents
- Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof2 Aug 2016US 9,403,190 B2
- Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards17 May 2016US 9,345,149 B2
- Liquid composite compositions using non-volatile liquids and nanoparticles and uses thereof1 Sep 2015US 9,120,121 B2
- Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards26 Jan 2017US 2017/0027065 A1
- Methods Of Enhancing Electrochemical Double Layer Capacitor (EDLC) Performance And EDLC Devices Formed Therefrom17 Sep 2015US 2015/0263543 A1
Most cited
By later US patents