Bundle Corporation
New York, NY, US· latest recorded location
BUNDLE CORPORATION is named on 0 US grants and 3 published applications in this corpus. Its most frequent classification is G06Q (Information and communication technology [ict] specially adapted for administrative, commercial, financial, managerial).
- Granted patents
- 0
- Published applications
- 3
- Inventors
- 3
- Granted in 2026 so far
- 0
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 0 | 3 |
By publication year.
Technology areas
Share of 3 documents
Recent patents
No granted patents yet.
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.