Abstract
A heat spreader includes a plurality of sensors that indicate that the heat spreader is flat against and in thermal contact with a plurality of chips when the heat spreader is loaded upon a chip stack. One or more nodes within the sensors are connected by electric conductors. The resistances of the conductors may be compared to determine if the nodes within the sensors are relatively flat. Sensor flatness may be indicated to a higher level electronic device such as a visual display. The display may ultimately be viewed by a user to determine whether the heat spreader is flat and in thermal contact with the plurality of chips when the heat spreader is loaded upon the chip stack.
Key facts
- Application
- 13/033,637Filed 24 Feb 2011
- Published
- US 2012/0217983 A130 Aug 2012
- Granted
- 15 Oct 2013
- Term ends
- Not estimatedThe source records don’t support an estimate.
Classification4 codes
- G01N 27/041
By investigating resistance: of a solid body
- H05K 7/20509
Characterised by the heat transfer by conduction from the heat generating element to a dissipating body: multiple-component heat spreaders;…
- G01N
Investigating or analysing materials by determining their chemical or physical properties
- H05K
Printed circuits
Family
- US 2012/0217983 A1Pre-grant publication · published 30 Aug 2012
- US 8,558,564 B2This patent
From the US filing history. Foreign family members aren’t listed.