1,995 results
PatentTitle and first matching claimMatch
- US 12,761,418 B2Granted 13 Oct 2026Optical packaging
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 12,757,652 B2Granted 6 Oct 2026
- US 12,757,404 B2Granted 6 Oct 2026Highly integrated semiconductor device
Samsung Electronics Co., Ltd.
- US 12,641,923 B2Granted 26 May 2026Display device and method of manufacturing the same
Samsung Display Co., Ltd.
- US 12,635,309 B2Granted 19 May 2026Semiconductor light emitting diode including passivation layer having different thicknesses
Samsung Display Co., Ltd.
- US 12,628,475 B2Granted 12 May 2026Display device and method of manufacturing the same
Samsung Display Co., Ltd.
- US RE50,887 E1Granted 12 May 2026Testing circuitry in a stacked semiconductor device using through silicon vias
Longitude Licensing Limited
- US 12,615,892 B2Granted 28 Apr 2026High-density micro-LED arrays with reflective sidewalls
Applied Materials, Inc.
- US 12,610,855 B2Granted 21 Apr 2026Display device
Samsung Display Co., Ltd.
- US 12,610,757 B2Granted 21 Apr 2026Film formation method and plasma processing method
Hitachi High-Tech Corporation
- US RE50,874 E1Granted 21 Apr 2026Memory arrays
Micron Technology, Inc.
- US RE50,869 E1Granted 14 Apr 2026
- US 12,598,968 B2Granted 7 Apr 2026Method of forming patterned structures
ASM IP Holding B.V.
- US 12,593,685 B2Granted 31 Mar 2026Semiconductor package
Samsung Electronics Co., Ltd.
- US 12,581,889 B2Granted 17 Mar 2026Dividing method of wafer
Disco Corporation
- US 12,581,708 B2Granted 17 Mar 2026
- US RE50,838 E1Granted 17 Mar 2026Electrostatic chuck assembly for high temperature processes
Applied Materials, Inc.
- US 12,575,446 B2Granted 10 Mar 2026Power semiconductor module system and method for producing the power semiconductor module system
Siemens Aktiengesellschaft
- US 12,569,949 B2Granted 10 Mar 2026Substrate processing apparatus
TDK Corporation
- US 12,568,860 B2Granted 3 Mar 2026Semiconductor device including through-silicon via (TSV) test device and operating method thereof
Samsung Electronics Co., Ltd.
- US 12,563,956 B2Granted 24 Feb 2026Display device
LG Display Co., Ltd.
- US RE50,796 E1Granted 10 Feb 2026Semiconductor package having spacer layer
Exo Imaging, Inc.
- US RE50,786 E1Granted 3 Feb 2026Semiconductor device including gate pattern having pad region
Samsung Electronics Co., Ltd.