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US RE49,046 E1Granted
Methods and apparatus for package on package devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Kai Liu, Kai-Chiang Wu, Hsien-Wei Chen, Shih-Wei Liang
Life of this patent
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Abstract
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device is formed by connecting a top package and a bottom package together using a plurality of PoP connectors on the bottom package connected to corresponding connectors of the top package. The PoP device further comprises a plurality of dummy connectors contained in the bottom package and not connected to any corresponding connector in the top package.
Claims38
A device comprising:
- a first substrate;
- a first die attached to a first surface of the first substrate;
- a second substrate attached to the first substrate, the first die being interposed between the first substrate and the second substrate;
- one or more signaling connectors interposed between the first substrate and the second substrate;
- and
- a plurality of dummy connectors interposed between the first substrate and the second substrate, the plurality of dummy connectors not passing electrical signals between the first substrate and the second substrate, the plurality of dummy connectors being connected to only one of first substrate and the second substrate, wherein a first dummy connector is a different size than a second dummy connector.
3 more elements
A device comprising:
- a first substrate;
- a first die attached to a first surface of the first substrate;
- a second substrate attached to the first substrate, the first die being interposed between the first substrate and the second substrate;
- an encapsulant on the first surface of the first substrate, the encapsulant extending to at least an upper surface of the first die, an uppermost surface of the encapsulant being spaced apart from the second substrate;
- one or more first connectors extending through the encapsulant to the first substrate, the one or more first connectors electrically coupling the first substrate to the second substrate, wherein the encapsulant has a first height and the one or more first connectors have the first height and wherein the one or more first connectors have curved sidewalls from a first side of the encapsulant to a second side of the encapsulant;
- one two or more dummy connectors extending through the encapsulant to the first substrate, the one two or more dummy connectors interposed between the first substrate and the second substrate, the one two or more dummy connectors not being electrically coupled between a conductive element and the first substrate;
- and
- one or more second connectors extending between corresponding ones of the one or more first connectors and the second substrate, wherein a first dummy connector is a different size than a second dummy connector.
5 more elements
A method comprising:
- providing a first substrate;
- attaching a first die to the first substrate;
- forming an encapsulant layer over the first substrate, wherein after the forming the encapsulant layer the encapsulant layer having has a signaling connector and a first dummy connector extending through an encapsulant of the encapsulant layer to the first substrate, the encapsulant layer being interposed between the signaling connector, the first dummy connector and the first die, wherein the encapsulant layer comprises a first material that has a straight sidewall which extends from a first side of the encapsulant layer to an opposite side of the encapsulant layer, the opposite side being in physical contact with the first substrate, wherein a second dummy connector extends through the encapsulant layer to the first substrate, the second dummy connector being a different size than the first dummy connector;
- removing a portion of the encapsulant layer to expose the signaling connector and the first dummy connector;
- and
- attaching a second substrate to the signaling connector, wherein the first dummy connector is electrically isolated from electrical devices on the second substrate.
3 more elements
A device comprising:
- a first substrate;
- a first die attached to a first surface of the first substrate;
- an encapsulant on the first surface of the first substrate, the encapsulant extending to at least an upper surface of the first die facing away from the first substrate, the encapsulant having a straight sidewall extending between a first side of the encapsulant to a second side of the encapsulant;
- one or more first connectors extending through the encapsulant to the first substrate, wherein at least one of the one or more first connectors comprises a first material in physical contact with the first substrate, the first material extending to a point located within the encapsulant;
- two or more dummy connectors extending through the encapsulant to the first substrate, the two or more dummy connectors not being electrically coupled between a conductive element and first substrate;
- and
- one or more second connectors extending over corresponding ones of the one or more first connectors, wherein a first dummy connector is a different size than a second dummy connector.
4 more elements
A device comprising:
- a first package comprising a first die placed on a first surface of a first substrate and a first connector connected to a second surface of the first substrate;
- and
- a second package comprising a second die, a second connector and a dummy connector, the second connector and the dummy connector extending through an encapsulant, the encapsulant being interposed between the dummy connectors and the second die, the encapsulant being non-conductive, wherein the dummy connector has a curved sidewall extending from a first side of the encapsulant to a second side of the encapsulant;
- wherein the first connector is connected to the second connector, and the dummy connector is not electrically connected to the first package, wherein the dummy connector is of a different size from a size of the second connector.
1 more element
A device comprising:
- a first die attached to a first surface of a first redistribution structure;
- an encapsulant in physical contact with the first surface, the encapsulant extending to at least an upper surface of the first die facing away from the first surface, the encapsulant comprising a first material throughout the encapsulant, the first material having a first external sidewall which is straight from a first surface of the encapsulant to a second surface of the encapsulant opposite the first surface;
- one or more first connectors extending through the encapsulant to the first surface of the first redistribution structure;
- and
- two or more dummy connectors extending through the encapsulant to the first surface of the first redistribution structure, the two or more dummy connectors not being electrically coupled between a conductive element and the first surface, wherein a first dummy connector is a different size than a second dummy connector.
2 more elements
Dependencies are inferred from the claim text.