High power light emitting diode package

A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising:

• an LED chip;
• a package body integrally formed with resin to have a recess for receiving the LED chip;
• a half T-shaped first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, wherein the first sheet metal member has an upper section electrically connected at one end with the LED chip and a lower section overlapped on the lower portion of the upper section, the bottom surface of the lower section being exposed through the bottom face of the package body to contact the board;
• a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member;
• and
• a transparent sealant sealingly filled up into the recess.

A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising:

• an LED chip;
• a package body integrally formed with resin to have a recess for receiving the LED chip;
• a first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, with a partial bottom surface of the first sheet metal member bent downward to be exposed through the bottom face of the package body and to contact the conductive pattern of the board;
• a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member;
• and
• a transparent sealant sealingly filled up into the recess.

A high power Light Emitting Diode (LED) package, comprising:

• an LED chip;
• a package body integrally formed with resin to have a recess for receiving the LED chip;
• a first sheet metal member electrically connected with the LED chip, the first sheet metal member having an upper partial portion supporting the LED chip in the recess, the first sheet metal member being surrounded by the package body and extending to a side face of the package body to be exposed to an outside of the package body, the first sheet metal member having a section extending downward from an inside of the package body so that a lower end of the section is exposed at a bottom face of the package body, such that the first sheet metal member is formed as a single body;
• a second sheet metal member electrically connected with the LED chip and spaced apart from the first sheet metal member by a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body;
• and
• a transparent sealant sealingly filled in the recess,
• wherein the first sheet metal member is a sheet metal extending continuously and integrally without any bonding or attachment, from the lower end exposed through the bottom face of the package body, through the inside of the package body and to the side face of the package body where the first sheet metal member is again exposed to the outside.