Thermal sensors for stacked dies
AssigneeUniforce Tech Limited Liability Company
InventorsKimmo Kuusilinna, Jani Klint, Tapio Hill
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Abstract
The invention relates to a method for obtaining temperature values from at least two thermal sensors arranged on resources within a three-dimensional die structure determining at least a partial three-dimensional temperature distribution for said die structure and controlling activity of said resources of said dies in response to said three-dimensional temperature distribution.
Claims78
A method comprising
- obtaining temperature values from at least two thermal sensors arranged on resources within a three-dimensional die structure;
- determining at least a partial three-dimensional temperature distribution for said die structure;
- and
- controlling activity of said resources of said dies in response to said three-dimensional temperature distribution.
A method comprising
- obtaining temperature values from a number of selected thermal sensors located on dies within a three-dimensional die structure;
- determining at least a partial three-dimensional temperature distribution for said die structure;
- controlling activity of resources of said dies in response to said three-dimensional temperature distribution.
A device comprising
- at least two semiconductor dies packaged together in a three-dimensional die structure;
- at least one thermal sensor located on each of said dies;
- a control unit connected to and controlling said thermal sensors;
- wherein said control unit is adapted to obtain temperature values sensed by said thermal sensors;
- determine at least a partial three-dimensional temperature distribution for said die structure;
- and
- issue throttle orders for resources on said dies in dependence of said temperature distribution.
A method comprising:
- obtaining temperature values from at least two thermal sensors arranged in proximity to resources within a three-dimensional die structure;
- performing one or more comparisons of the temperature values to each other;
- and
- controlling activity of one or more of the resources in response to the one or more comparisons.
A device comprising:
- at least two semiconductor dies packaged together in a three-dimensional die structure;
- at least one thermal sensor located on each of said dies;
- a control unit connected to and configured to control the thermal sensors;
- wherein the control unit is further configured to:
- obtain temperature values from at least two thermal sensors arranged in proximity to resources within the three-dimensional die structure;
- perform one or more comparisons of the temperature values to each other;
- and
- control activity of one or more of the resources in response to the one or more comparisons.
A non-transitory computer program product including computer program code that, if executed by a device, causes the device to implement operations comprising:
- obtaining temperature values from at least two thermal sensors arranged in proximity to resources within a three-dimensional die structure;
- performing one or more comparisons of the temperature values to each other;
- and
- controlling activity of one or more of the resources in response to the one or more comparisons.
Dependencies are inferred from the claim text.