Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole

The multilayer printed wiring board comprising:

• a substrate provided with having at least one through-hole structure, the substrate having the at least one through-hole structure being filled with a filler;
• at least one interlaminar resin insulating layer formed thereon on the substrate;
• and
• at least one conductor circuit formed on the at least one interlaminar resin insulating layer, the at least one through-hole being filled with filler ,
• wherein an internal surface of the at least one through-hole structure is roughened, and the filler comprises a particulate substance including metal particles having a particle size of from 0.1 to 30 μm, a resin, and an ultrafine inorganic powder having a particle size from 1 to 1000 2 to 100 nm.

A multilayer printed wiring board comprising:

• a substrate provided with having at least one through-hole structure, the substrate having the at least one through-hole structure comprising a plated film and being filled with a filler;
• at least one interlaminar resin insulating layer formed thereon on the substrate;
• and
• at least one conductor circuit formed on the at least one interlaminar resin insulating layer, the at least one through-hole being filled with filler ,
• wherein an internal a surface of the plated film of the at least one through-hole structure is roughened, and the filler comprises metal particles and one of thermosetting and thermoplastic resin resins, and an exposed portion of the filler in the at least one through-hole is covered with a portion of the at least one conductor circuit through-hole-covering conductor layer.

The multilayer printed wiring board comprising:

• a substrate provided with having at least one through-hole structure, the substrate having the at least one through-hole structure being filled with a filler;
• at least one interlaminar resin insulating layer formed thereon on the substrate;
• and
• at least one conductor circuit formed on the at least one interlaminar resin insulating layer, the at least one through-hole being filled with filler ,
• wherein an internal surface of the at least one through-hole structure is roughened, and the filler comprises a particulate substance having a particle size of from 0.1 to 30 μm, a resin, and an ultrafine inorganic powder having a particle size from 1 to 1000 2 to 100 nm, and an exposed portion of the filler in the at least one through-hole structure is covered with a portion of the at least one conductor circuit through-hole-covering conductor layer.

A multilayer printed wiring board comprising:

• a substrate provided with having at least one through-hole structure, the substrate having the at least one through-hole structure comprising a plated film and being filled with a filler;
• at least one interlaminar resin insulating layer formed thereon on the substrate;
• and
• at least one conductor circuit formed on the at least one interlaminar resin insulating layer, the at least one through-hole being filled with filler ,
• wherein an internal a surface of the plated film of the at least one through-hole structure is roughened, and the filler comprises metal particles and one of thermosetting and thermoplastic resin resins, and an exposed surface of the filler in the at least one through-hole structure is covered with a portion of the at least one conductor circuit through-hole-covering conductor layer, and at least one viahole is formed in the at least one interlaminar resin insulating layer just directly above the at least one conductor circuit and is connected to the at least one conductor circuit through-hole-covering conductor layer.

A multilayer printed wiring board comprising:

• a substrate provided with having at least one through-hole structure, the substrate having the at least one through-hole structure being filled with a filler;
• at least one interlaminar resin insulating layer formed thereon on the substrate;
• and
• at least one conductor circuit formed on the at least one interlaminar resin insulating layer, the at least one through-hole being filled with filler ,
• wherein an internal surface of the at least one through-hole structure is roughened, and the filler comprises a particulate substance having a particle size of from 0.1 to 30 μm, a resin, and an ultrafine inorganic powder having a particle size from 1 to 1000 2 to 100 nm, and an exposed surface of the filler in the at least one through-hole structure is covered with a portion of the at least one conductor circuit through-hole-covering conductor layer, and at least one viahole is formed in the at least one interlaminar resin insulating layer just directly above the at least one conductor circuit and is connected to the at least one conductor circuit through-hole-covering conductor layer.

A process of producing a multilayer printed wiring board comprising:

• forming a hole in a substrate;
• forming at least one conductor layer on both surfaces of a substrate by electroless plating,
• forming at least one a through-hole on structure in the substrate, by plating a layer on a surface of the hole;
• forming a roughened layer on an internal roughening a surface of the plated layer of the at least one through-hole structure;,
• filling the at least one through-hole structure including the plated layer having the a roughened layer on its internal surface with a filler comprising metal particles and one of thermosetting and thermoplastic resin, and drying and curing the filler, resins;
• forming a first conductor layer having a first conductor circuit on the substrate;
• forming at least one a first interlaminar resin insulating layer, and on the first conductor circuit and the substrate;
• forming an opening for a via hole in the interlaminar resin insulating layer;
• and
• forming at least one a second conductor layer having a second conductor circuit by electroless plating on the first interlaminar resin insulating layer and the via hole in the opening,
• wherein the via hole is formed to connect the first conductor circuit and the second conductor circuit.

A process of producing a multilayer printed wiring board, comprising:

• forming a hole in a substrate;
• forming at least one conductor layer on both surfaces of a substrate by electroless plating,
• forming at least one a through-hole through structure in the substrate, by plating a layer on a surface of the hole;
• forming a roughened layer on an internal roughening a surface of the plated layer of the at least one through-hole, structure;
• filling the at least one through-hole structure including the plated layer having the a roughened layer on its internal surface with a filler comprising a particulate substance including metal particles having a particle size of from 0.1 to 30 μm, a resin, and an ultrafine inorganic powder having a particle size from 1 to 1000 2 to 100 nm, and drying and curing the filler, ;
• forming a first conductor layer having a first conductor circuit on the substrate;
• forming at least one a first interlaminar resin insulating layer, and on the first conductor circuit and the substrate;
• forming an opening for a via hole in the first interlaminar resin insulating layer;
• and
• forming at least one a second conductor layer having a second conductor circuit by electroless plating on the first interlaminar resin insulating layer and the via hole in the opening,
• wherein the via hole is formed to connect the first conductor circuit and the second conductor circuit.

A process of producing a multilayer printed wiring board comprising:

• forming at least one conductor layer on both surfaces of a substrate by electroless plating,
• forming at least one through-hole on the substrate,
• forming a roughened layer on an internal surface of the at least one through-hole,
• filling the at least one through-hole having the roughened layer on its internal surface with filler comprising metal particles and one of thermosetting and thermoplastic resin, and drying and curing the filler,
• forming a portion of the at least one conductor layer on the at least one through-hole by subjecting a portion of the filler on the at least one through-hole to electroless plating,
• forming at least one interlaminar resin insulating layer, and
• forming at least one conductor circuit by electroless plating.

A process of producing a multilayer printed wiring board comprising:

• forming at least one conductor layer on both surfaces of a substrate by electroless plating,
• forming at least one through-hole on the substrate,
• forming a roughened layer on an internal surface of the at least one through-hole,
• filling the at least one through-hole having the roughened layer on its internal surface with filler comprising particulate substance having a particle size of from 0.1 to 30 μm, resin, and ultrafine inorganic powder having a particle size from 1 to 1000 nm, and drying and curing the filler,
• forming a portion of the at least one conductor layer on the at least one through-hole by subjecting a portion of the filler on the at least one through-hole to electroless plating,
• forming at least one interlaminar resin insulating layer, and
• forming at least one conductor circuit by electroless plating.

A process of producing a multilayer printed wiring board comprising:

• forming a hole in a substrate;
• forming at least one conductor layer on both surfaces of a substrate by electroless plating,
• forming at least one a through-hole on structure in the substrate, by plating a layer on a surface of the hole;
• forming a roughened layer on an internal roughening a surface of the plated layer of the at least one through-hole, structure;
• filling the at least one through-hole structure including the plated layer having the a roughened layer on its internal surface with a filler comprising metal particles and one of the thermosetting and thermoplastic resin, and drying and curing the filler, resins;
• forming a portion of the at least one first conductor layer having a through-hole-covering conductor layer on the at least one through-hole by subjecting a portion of the filler on the at least one through-hole to electroless plating, structure;
• forming at least one a first interlaminar resin insulating layer, on the first conductor layer;
• and
• forming at least one viahole in the first interlaminar resin insulating layer and at least one a second conductor circuit in on the at least one first interlaminar resin insulating layer located just above the at least one through-hole, and ,
• wherein the at least one viahole is formed at a position directly above the through-hole structure and provided to connect the through-hole-covering conductor layer with the second conductor circuit
• connecting the at least one viahole to the at least one conductor circuit in the at least one interlaminar resin insulating layer located just above the at least one through-hole .

A process of producing a multilayer printed wiring board comprising:

• forming a hole in a substrate;
• forming at least one conductor layer on both surfaces of a substrate by electroless plating,
• forming at least one a through-hole on structure in the substrate, by plating a layer on a surface of the hole;
• forming a roughened layer on an internal roughening a surface of a plated layer of the at least one through-hole structure,
• filling the at least one through-hole structure including the plated layer having the a roughened layer on its internal surface with a filler comprising a particulate substance having a particle size of from 0.1 to 30 μm, a resin, and an ultrafine inorganic powder having a particle size from 1 to 1000 2 to 100 nm, and drying and curing the filler, ;
• forming a portion of the at least one first conductor layer having a through-hole-covering conductor layer on the at least one through-hole by subjecting a portion of the filler on the at least one through-hole to electroless plating, structure;
• forming at least one a first interlaminar resin insulating layer, ;
• and
• forming at least one viahole in the first interlaminar resin insulating layer and at least one a second conductor circuit in on the at least one first interlaminar resin insulating layer located just above the at least one through-hole, and ,
• wherein the viahole is formed at a position directly above the through-hole structure and provided to connect the through-hole-covering conductor layer with the second conductor circuit
• connecting the at least one viahole to the at least one conductor circuit located just above the at least one through-hole .

A multilayer printed wiring board comprising:

• a substrate having a through-hole structure comprising a plating layer and a filler provided in the through-hole structure, the plating layer having a roughened portion;
• a first conductor layer having a first conductor circuit formed on the substrate and a through-hole-covering conductor layer covering the filler provided in the through-hole structure having the plating layer;
• a first interlaminar resin insulating layer having a via hole and being formed on the substrate and the first conductor layer;
• and
• a second conductor layer having a second conductor circuit formed on the first interlaminar resin insulating layer, the second conductor circuit being connected to the first conductor circuit by the via hole.

A process of producing a multilayer printed wiring board comprising:

• forming a hole in a substrate;
• forming a through-hole structure in the substrate by plating a layer on a surface of the hole;
• roughening a portion of the plating layer of the through-hole structure;
• filling a filler inside the through-hole structure;
• forming a first conductor layer having a first conductor circuit on the substrate and a through-hole-covering conductor layer covering the filler;
• forming a first interlaminar resin insulating layer on the first conductor layer and substrate;
• forming an opening for a via hole in the interlaminar resin insulating layer;
• and
• forming a second conductor layer having a second conductor circuit on the first interlaminar resin insulating layer and the via hole in the opening,
• wherein the via hole is formed to connect the first conductor circuit and the second conductor circuit.