US D845,368 S1Granted

Spoked solder pad

OwnerMyron Walkerinventor

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Abstract

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Claims1

Dependent claims

The ornamental design for a spoked solder pad, as shown and described.

Facts

Application: 29/636,907Filed 12 Feb 2018 · division
Priority: 19 Dec 2014
Granted: 9 Apr 2019
Term ends: Not estimatedThe source records don’t support an estimate.

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Family

Application29/512,592Parent of this division · filed 19 Dec 2014
US D816,135 S1Parent of this division
US D845,368 S1This patent

From the US filing history. Foreign family members aren’t listed.

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