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US D725,591 S1Granted
Mobile power pack for electronic device
AssigneeChi Mei Communication Systems, Inc.
InventorsShih-Chieh Chien, Chia-Chia Huang, Ho-An Chen, Tzu-Cheng Yu
Life of this patent
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Abstract
The abstract isn’t available for this document.
Claims1
The ornamental design for a mobile power pack for electronic device, as shown and described.