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US D690,278 S1Granted
Adhesive tape for semiconductor manufacturing
AssigneeHitachi Chemical Company, Ltd.
InventorsKouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
Life of this patent
Estimating the term…
Abstract
The abstract isn’t available for this document.
Claims1
The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.