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US D483,337 S1Granted
Portion of a matrix for surface mount package leadframe
AssigneeGEM Services, Inc.
InventorsJames Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
Life of this patent
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Abstract
The abstract isn’t available for this document.
Claims1
The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.