Semiconductor die package and method of producing the package

A semiconductor die package comprising:

• a substrate formed of a mold material, wherein embedded side by side in the mold material are a first semiconductor die and a Through Substrate Via (TSV) insert, the substrate, the TSV insert, and the first semiconductor die having a front side and a back side, and wherein
• the TSV insert comprises N contacts on the front side of the TSV insert, N contacts on the backside of the TSV insert, and N metal-filled vias individually interconnecting the contacts on the front and back sides of the TSV insert, N being an integer higher than or equal to 1,
• the first semiconductor die comprises N contacts on the front side of the first semiconductor die,
• the first semiconductor die further comprises one or more contact terminals on the front side of the first semiconductor die;
• a second semiconductor die mounted on the back side of the substrate, the second semiconductor die comprising N contacts which are individually connected to the N contacts of the TSV insert on the back side of the TSV insert;
• a lateral connecting device mounted on the front side of the first semiconductor die and the TSV insert, the lateral connecting device being provided with a first and second group of N contacts each, the groups being placed side by side on the same surface of the lateral connecting device, wherein the first and second group of N contacts are individually interconnected inside the lateral connecting device, and wherein the first and second groups of N contacts on the lateral connecting device are individually connected respectively to the N contacts on the first semiconductor die and to the N contacts of the TSV insert on the front side of the TSV insert, so that the N contacts on the first semiconductor die are individually connected to the N contacts on the second semiconductor die, through the lateral connecting device and the TSV insert;
• and
• a plurality of package level contact bumps connected to at least some of the contact terminals on the first semiconductor die.