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US 9,960,124 B2Granted
Integrated shield structure for mixed-signal integrated circuits
AssigneeGeneral Electric Company
InventorsJames Wilson Rose, Oliver Richard Astley, Donna Marie Sherman, Jonathan David Short
Life of this patent
Estimating the term…
Abstract
In certain embodiments, a mixed signal integrated circuit is provided that includes both a digital portion and an analog portion. A shield is provided that overlays one of the digital portion or the analog portion of the mixed signal integrated circuit. The shield limits propagation of signals between the digital portion and the analog portion of the mixed signal integrated circuit.
Claims17
A mixed signal integrated circuit assembly, comprising:
- a substrate comprising a plurality of conductive traces and contact pads, wherein the substrate comprises:
- a digital portion configured to route and process digital signals;
- and
- an analog portion configured to route and process analog signals;
- and
- a packaging structure, comprising:
- a first shield formed on a facing surface of the packaging structure disposed about at least a portion of the substrate, the first shield positioned over the digital portion of the substrate so as to limit propagation of signals between the digital portion and the analog portion;
- and
- a second shield formed on the facing surface of the packaging structure disposed about at least a second portion of the substrate, the second shield position over the analog portion of the substrate,
- wherein the packaging structure is configured to geometrically align the first shield with the digital portion of the substrate and the second shield with the analog portion of the substrate.
7 more elements
A semiconductor package assembly, comprising:
- a mixed signal integrated circuit comprising:
- a digital portion configured to route and process digital signals;
- and
- an analog portion configured to route and process analog signals;
- a package structure configured to interface with the mixed signal integrated circuit to form the semiconductor package assembly, the package structure comprising:
- a first shield and a second shield formed as a facing surface of the packaging structure, wherein the first shield, when interfaced with the mixed signal integrated circuit, is configured to correspond to the shape, size, and position of the digital portion of the mixed signal integrated circuit and the second shield, when interfaced with the conversion circuit, is configured to correspond to the shape, size, and position of the analog portion of the mixed signal integrated circuit when the package structure is assembled with the mixed signal integrated circuit, wherein the first shield and the second shield limits propagation of signals between the digital portion and the analog portion of the mixed signal integrated circuit, wherein the package structure and mixed signal integrated circuit are separate non-integral components with respect to one another.
3 more elements
A non-invasive imaging system, comprising:
- a detector assembly configured to generate analog signals in response to detected signals;
- a conversion circuit configured to convert the analog signals to digital signals, the conversion circuit comprising:
- an analog portion configured to route and process the analog signals;
- a digital portion configured to route and process digital signals;
- and
- a package structure configured to interface with the conversion circuit to form a semiconductor package assembly, the package structure having a first shield and a second shield formed on a facing surface of the packaging structure, wherein the first shield, when interfaced with the conversion circuit, is configured to correspond to the shape, size, and position of the digital portion and the second shield, when interfaced with the conversion circuit, is configured to correspond to the shape, size, and position of the analog portion of the conversion circuit, wherein the first shield and the second shield limit limit propagation of signals between the digital portion and the analog portion of the conversion circuit, wherein the package structure and conversion circuit are separate non-integral components with respect to one another;
- and
- a processing component configured to receive and process the digital signal to generate one or more images and to display the one or more images.
5 more elements
Dependencies are inferred from the claim text.