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US 9,957,611 B2Granted
Removal device for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
AssigneeKabushiki Kaisha Toshiba
InventorHirokazu Hayashi
Life of this patent
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Abstract
Provided is a removal device for a semiconductor manufacturing apparatus according to an embodiment including a reservoir being connectable to a reaction chamber where a film is formed on a substrate and storing a byproduct derived from an exhaust gas exhausted from the reaction chamber, a vacuum generator driven by a driving gas, and a suction pipe having one connected to the reservoir and the other connected to the vacuum generator and suctioning the byproduct.
Claims8
A removal device for a semiconductor manufacturing apparatus, comprising:
- a reservoir capable of being connected to a reaction chamber configured to forma film on a substrate, the reservoir storing byproduct derived from an exhaust gas exhausted from the reaction chamber;
- a vacuum generator driven by a driving gas, the vacuum generator configured to generate a suction force by the driving gas;
- a driving gas supply pipe connected to the vacuum generator, the driving gas supply pipe configured to supply the driving gas to the vacuum generator;
- a suction pipe having one end connected to the reservoir and the other end connected to the vacuum generator, the suction pipe suctioning configured to suction the byproduct from the reservoir by the suction force generated by the vacuum generator;
- a discharge pipe connected to the vacuum generator, the discharge pipe configured to discharge the byproduct suctioned by the vacuum generator and the suction pipe;
- a heating mechanism heating the driving gas;
- a temperature sensor measuring temperature of the driving gas passing the vacuum generator;
- and
- a controller controlling the heating mechanism based on a measurement value of the temperature sensor.
6 more elements
Dependencies are inferred from the claim text.