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US 9,957,605 B2Granted
Substrate fixing apparatus
AssigneesBoe Technology Group Co., Ltd., Beijing Boe Display Technology Co., Ltd.
InventorHualong Wang
Life of this patent
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Abstract
A substrate fixing apparatus includes a metal frame body. A central portion of the metal frame body is provided with a through hole; a recess configured for bearing a substrate is formed on the metal frame body along an edge of the through hole; the recess is recessed towards an inside of the metal frame body along a thickness direction of the metal frame body; and a first insulating pad is disposed at the bottom of the recess.
Claims10
A substrate fixing apparatus, comprising a metal frame body,
- wherein a central portion of the metal frame body is provided with a through hole;
- a recess configured for bearing a substrate is formed on the metal frame body along an edge of the through hole;
- the recess is recessed towards an inside of the metal frame body along a thickness direction of the metal frame body;
- a first insulating pad is disposed at the bottom of the recess;
- and
- a second insulating pad is disposed on the first insulating pad.
3 more elements
Dependencies are inferred from the claim text.