Capacitive micromachined ultrasonic transducer and method of fabricating the same

A capacitive micromachined ultrasonic transducer (CMUT) comprising:

• a device substrate having a plurality of elements, the device substrate comprising a first trench defining a plurality of first portions corresponding to each of the plurality of elements such that each individual element among the plurality of elements corresponds to a respective plurality of first portions, and a second trench spaced apart from the first trench;
• a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities;
• a membrane provided on the supporting unit to cover the plurality of cavities;
• a top electrode electrically connected to a second portion surrounded by the second trench through a via hole penetrating through the membrane and the supporting unit;
• and
• a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate comprising a plurality of first via metals, each one of the plurality of first via metals being respectively connected to a corresponding plurality of the first portions corresponding to each of the plurality of elements and a second via metal connected to the second portion,
• wherein the plurality of first via metals are electrically isolated from one another.