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US 9,883,615 B2Granted
Semiconductor memory device having a heat conduction member
AssigneeToshiba Memory Corporation
InventorKouei Yoshinaga
Life of this patent
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Abstract
A semiconductor memory device includes a substrate having a conductive region on a surface thereof, a semiconductor memory unit, a memory controller, at least one of the semiconductor memory unit and the memory controller being disposed on the substrate, a housing enclosing the substrate, and a heat conduction member in contact with and pressed between the conductive region and a portion of the housing.
Claims18
A semiconductor memory device, comprising:
- a substrate having a conductive region on a surface thereof;
- a semiconductor memory unit;
- a memory controller, at least one of the semiconductor memory unit and the memory controller being disposed on the substrate;
- a housing enclosing the substrate;
- and
- a heat conduction member in contact with and pressed between the conductive region and a portion of the housing, wherein the heat conduction member is made of an electrically-insulating material.
3 more elements
A semiconductor memory device, comprising:
- a first substrate having a first conductive region on a first surface thereof, and a second conductive region and a connector on a second surface thereof, the second surface being opposite to the first surface;
- a second substrate positioned on the second surface side of the first substrate and electrically connected to the connector;
- a semiconductor memory unit disposed on the first substrate;
- a memory controller disposed on the second substrate;
- a housing enclosing the first and second substrates and including a top cover member and a frame member;
- a first heat conduction member in contact with and pressed between the first conductive region and the top cover member;
- and
- a second heat conduction member in contact with and pressed between the second conductive region and the frame member.
5 more elements
A semiconductor memory device, comprising:
- a substrate having a conductive region on a surface thereof;
- a semiconductor memory unit;
- a memory controller, at least one of the semiconductor memory unit and the memory controller being disposed on the substrate;
- a housing enclosing the substrate;
- and
- a heat conduction member in contact with and between the conductive region and a portion of the housing, such that heat is transferred from the conductive region to the portion of the housing therethrough, wherein the heat conduction member is made of an electrically-insulating material.
3 more elements
Dependencies are inferred from the claim text.