Heat sink attachment on existing heat sinks

A structure comprising:

• a platform;
• a laminate substrate mounted on said platform;
• a first electronic component on said laminate substrate, said first electronic component being electrically connected to said laminate substrate;
• a first heat sink comprising a first base and fins extending from said first base, said first base comprising a cutout therein and a first base bottom surface contacting said first electronic component;
• a second electronic component on said laminate substrate, said second electronic component being electrically connected to said laminate substrate;
• a second heat sink, separate from said first heat sink, said second heat sink comprising a second base and fins extending from said second base, said second heat sink being located in said cutout of said first heat sink but not contacting said first heat sink, and said second base comprising a second base bottom surface contacting said second electronic component;
• a pressure plate, separate from said first heat sink and said second heat sink, said pressure plate overlaying and contacting said second heat sink, said pressure plate comprising openings extending from a top surface of said pressure plate to a bottom surface of said pressure plate;
• and
• first fasteners penetrating said openings in said pressure plate and attached only to said first heat sink, said first fasteners comprising a shaft and compression elements surrounding a portion of said shaft, said pressure plate being positioned to apply pressure between said second heat sink and said second electronic component, said compression elements enabling relative movement between said pressure plate and said first heat sink.

A method comprising:

• providing a platform having a top surface and a bottom surface;
• mounting a first electronic component on said top surface of said platform;
• mounting a second electronic component on said top surface of said platform;
• providing a first heat sink, said first heat sink having a first bottom surface contacting said first electronic component and a cutout therein, said second electronic component being located in said cutout;
• providing a second heat sink having a second bottom surface contacting said second electronic component in said cutout of said first heat sink, said second heat sink being separate from said first heat sink and not contacting said first heat sink;
• and
• attaching a pressure plate to said first heat sink over said second heat sink, said pressure plate comprising openings extending from a top surface of said pressure plate to a bottom surface of said pressure plate, said pressure plate contacting said second heat sink and being positioned to apply pressure between said second heat sink and said second electronic component, said pressure plate being separate from said first heat sink and said second heat sink,
• said attaching comprising inserting first fasteners through said openings in said pressure plate and connecting said first fasteners to said first heat sink, said fasteners comprising a shaft and compression elements surrounding a portion of said shaft, said compression elements enabling relative movement between said pressure plate and said first heat sink.