Circuit board and method for manufacturing the same

A method for a circuit board having a heat-recovery function, comprising:

• forming at least one first via at a single-layer dielectric layer and disposing at least one first heat-conducting pillar in the first via;
• building up a plurality of buildup-dielectric layers from the single-layer dielectric layer to form a substrate;
• respectively forming a first recess and a second recess on two opposite surfaces of the substrate, wherein the single-layer dielectric layer is between the first recess and the second recess;
• disposing a thermoelectric device into the first recess for embedding the thermoelectric device in the substrate, wherein the thermoelectric device is connected to the first heat-conducting pillar;
• forming at least one second via at a heat-storing device and filling the second via with at least one second heat-conducting pillar such that the heat-storing device is penetrated by the second heat-conducting pillar;
• disposing a processor on the heat-storing device, wherein the processor is connected to and in contact with the second heat-conducting pillar;
• and
• disposing the heat-storing device and the processor into the second recess for embedding the heat-storing device in the substrate, wherein the heat-storing device is between the processor and the thermoelectric device.