Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewith

A method for producing a power electronic switching device, the power electronics switching device comprising a substrate, a power semiconductor component arranged on the substrate, a connection device and terminal devices, the method comprising the following steps:

• A. providing the substrate with an insulation ply and at least first and second conductor tracks electrically insulated from one another, wherein the power semiconductor component is arranged on one of said first and second conductor tracks and is cohesively connected to said one of said first and second conductor tracks;
• B. arranging the connection device as a layered film stack having alternating layers with at least two electrically conductive, intrinsically structured films, and an electrically insulating film between said two conductive films;
• C. applying a thin pressure- and temperature-resistant and moisture-blocking insulation layer to a surface contour of the connection device, said insulation layer comprising a covering section which covers the connection device and an overlap section, which overlaps the connection device circumferentially on all sides and covers the substrate in a circumferential contact region;
• D. cohesively connecting the connection device to the substrate, whereby the power electronic switching device is connected in a circuit-conforming manner internally by means of the connection device;
• E. connecting said covering section of said insulation layer to the connection device;
• and
• F. connecting said overlap section of said insulation layer to said contact region of the substrate.