Wiring board and method for manufacturing the same

A wiring board, comprising:

• a substrate having a plurality of opening portions penetrating through the substrate and positioned such that the opening portions form at least one boundary portion separating the opening portions and have edges defining a surface of the boundary portion;
• a plurality of electronic devices positioned in the plurality of opening portions of the substrate, respectively;
• a conductive pattern formed on the surface of the boundary portion such that the conductive pattern is formed between the edges of the opening portions and continuously extending along the edges of the opening portions on the surface of the boundary portion;
• an opposing conductive pattern formed on an opposite surface of the boundary portion with respect to the conductive pattern on the surface of the boundary portion;
• and
• an insulation layer formed on the substrate such that the insulation layer is covering and directly laid on the conductive pattern on the boundary portion and the plurality of electronic devices in the plurality of opening portions of the substrate,
• wherein the boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm, and the conductive pattern is formed on the surface of the boundary portion such that the conductive pattern is covering substantially the width of the boundary portion on the surface of the boundary portion.