Substrate support assembly having rapid temperature control

A substrate support assembly capable of holding and heating a substrate in a process chamber, the assembly comprising:

• (a) a ceramic puck comprising:
• (i) a substrate receiving surface;
• (ii) an electrode therein to generate an electrostatic force to retain a substrate placed on the substrate receiving surface;
• (iii) a heater therein to heat the substrate, the heater comprising first and second heater coils that are radially spaced apart;
• and
• (iv) a backside surface having a plurality of shaped mesas that are spaced apart from one another and that contact an underlying base, the shaped mesas comprising posts, cones, rectangular blocks, or cylindrical mounds, and the shaped mesas comprising an array of first mesas adjacent to a channel inlet adjacent to a periphery of the base and an array of second mesas that are adjacent a channel terminus, the first mesas being spaced apart a first distance that is larger than a second distance between the second mesas, and the first mesas having a first contact area that is smaller than a second contact area of the second mesas;
• (b) the base comprising a channel to circulate fluid therethrough, the channel comprising the channel inlet and the channel terminus;
• and
• (c) a compliant layer bonding the ceramic puck to the base.

A substrate support assembly capable of holding and heating a substrate in a process chamber, the assembly comprising:

• (a) a ceramic puck comprising a substrate receiving surface and an opposing backside surface, the ceramic puck comprising (i) an electrode in the ceramic puck to generate an electrostatic force to retain a substrate placed on the substrate receiving surface, and (ii) a heater in the ceramic puck to heat the substrate, the heater comprising first and second heater coils that are radially spaced apart;
• (b) a base comprising a channel to circulate fluid therethrough, the channel comprising an inlet and terminus;
• (c) a compliant layer bonding the ceramic puck to the base;
• and
• (d) a controller configured to (i) independently apply different electrical power levels to the first and second heater coils, (ii) control the temperature and flow rate of fluid passed through the channel of the base, (iii) receive temperature signals from a temperature sensor, and (iv) serve as a feedback control loop to adjust the power applied to the first and second heater coils and the flow of fluid through the channel of the base in response to the temperature signals from the temperature sensor, and
• wherein the controller is programmed to (1) increase a fluid temperature in the base to a higher level prior to ramping up the electrical power levels applied to the heater in the ceramic puck, or (2) decrease a fluid temperature in the base to a lower level prior to ramping down the electrical power levels applied to the heater in the ceramic puck.